Loud fan, little airflow
A fan can sound busy while intake dust or a blocked vent limits cooling. Compare the loud fan with poor airflow checks before assuming the processor needs new paste.
COOLING WORKSPACE / 01
Compare measured temperatures, identify your next cooling check, and see what the numbers can—and cannot—tell you about thermal throttling.
Temperature is a clue.
Context is the diagnosis.
01 / YOUR HARDWARE
100°C is an editable example, not a safe limit for every laptop. Enter the limit for your exact processor and OEM configuration. Architecture labels never silently change it.
Noise is your observation, not a decibel measurement. Choose “Fanless” for a laptop without a fan.
Use comparable sustained readings from the same workload and power profile. A change in clock speed does not prove a thermal cause.
02 / LIVE COMPARISON
This meter is peak °C ÷ chosen limit °C. It is a comparison scale, not a probability, material stress calculation, or measured throttling percentage.
Start with workload and ventilation checks. Paste condition requires inspection and controlled comparison.
The stress meter is a temperature comparison, not a hardware diagnosis or a probability of failure.
These example temperature/duty points illustrate an increasing curve. They are not validated settings for your device. Use manufacturer-supported profiles; this page never applies hardware settings or overrides thermal protection.
| Temperature | Example duty |
|---|---|
| 50.0°C | 30% |
| 70.0°C | 50% |
| 85.0°C | 75% |
| 95.0°C | 100% |
Fanless hardware has no fan curve. Improve placement and workload conditions instead.
03 / CHOOSE YOUR PATH
A fan can sound busy while intake dust or a blocked vent limits cooling. Compare the loud fan with poor airflow checks before assuming the processor needs new paste.
CPU heat, GPU heat, and heat soak need separate observations. Use the gaming thermal throttling guide with clocks and frame-time behavior from the same test.
Compare the dust versus thermal paste decision path. Fan faults, heatsink contact, and thermal pads can mimic paste problems; a repaste is not a universal fix.
The profiler compares readings you enter. It does not connect to system sensors. Headroom is your chosen thermal limit minus the peak temperature. The stress meter uses the Celsius values, so switching to Fahrenheit changes the labels without changing the result.
When you enter a reference and current clock, observed reduction is 100 × (1 − current ÷ reference), with increases displayed as zero reduction. Clock changes can also come from power limits, workload changes, or normal boost behavior. Confirm thermal throttling with the telemetry tools and diagnostics for your model.
Device age helps prompt a maintenance review, but it cannot establish how much thermal paste has degraded. Installation, heatsink pressure, material, workload, and service history all matter. Start with safe laptop vent cleaning, compare controlled before-and-after readings, and check service coverage before a repaste.
Record room conditions, the sensor name, workload, power profile, and whether the laptop is charging. Let transient spikes settle before comparing sustained behavior. If the battery area is unusually hot, use the battery heat and swelling warning guide instead of continuing a load test. Apple Silicon owners can follow the MacBook overheating decision path, including checks suited to fanless models.
Educational comparison tool. No laboratory testing, manufacturer approval, component certification, or professional inspection is implied. Learn about the publication and correction process on the about page.